C Microsemi Logo NXP Logo 69200 M15M7V4 XXXXX5 YYYYY6 PD69200DVVVVSS PD-OOOOG3bb7 YYWW PD69200D-VVVVSS-TR Plastic QFN Tape and 5 mm x 5 mm Reel (32 lead) -40 C to 85 C Microsemi Logo NXP Logo 69200 M15M7V4 XXXXX5 YYYYY6 PD69200VVVVSS-TR PD-OOOOT3bb7 YYWW PD69208MILQ-TR-LE Plastic QFN Tape and 8 mm x 8 mm Reel (56 lead) -40 C to 85 C Microsemi Logo PD69208M F R e48 YYWWAZZ9 PD69208MILQ-TR Plastic QFN Tape and 8 mm x 8 mm Reel (56 lead) -40 C to 85 C Microsemi Logo PD69208M F R e48 YYWWAZZ9 PD69200D1 2 3 -VVVV SS 1. 2. 3. 4. 5. 6. 7. 8. 9. D stands for the detection method set as: C: Detection Method = IEEE802.3 and pre-standard; R: Detection Method = IEEE802.3. VVVV is firmware revision SS stands for firmware parameters option Short part number Mask set Date code MKTG Product Type (Detection = R: Resistor/D = C: Resistor/Legacy)/Version/SW Parameters/Operation P/N. F = FAB Code, R = Product revision code (D for V2R2 and E for V2R4), and e4 = 2nd level interconnect. YY = Year, WW = Week, A = Assem